Die Bonding AOI
LEAPER's Die Bonding AOI Inspection System, centered around a multi-modal optical inspection matrix and intelligent algorithms, provides comprehensive protection for Flip Chip packaging quality, from outside to inside. The system achieves sub-micro level positioning, captures micro-level defects, and supports ultra-high-speed 15K+ online inspection and multi-channel serial/parallel inspection.
Hybrid Algorithm Architecture
Combining AI with traditional algorithms/ Breaking through micron-level detection limits/ Dynamically correcting image differences
Intelligent Optical Solutions
Flexible combination of line scan and area scan solutions/ Multi-angle/multi-spectrum/illumination sources highlight subtle defect features
Flexible Software Design
Module design/ Development-oriented architecture/ Scalable and extensible for further development
Precision Mechatronic Structure
Autofocus/ Vibration resistance design/ Multi-channel serial/parallel implementation for sub-micro level equipment precision
